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Product 01 IP-R&D Agent

ChipInsight

From research planning that cracks the hard problem to finding the business opportunity

It is like adding an analyst to the team. It searches patents, papers, standards, and supply chains on its own, builds a conclusion, and marks which figures are measured and which are vendor claims. All that is left is the judgement.

C ChipInsight Lab
Search technologies, companies, and document numbers together ⌘K
Korean ⌄ A
Design-around scenarios

It decomposes the claim elements and compares alternatives that lower IP risk while preserving performance and manufacturability.

ACTIVE SCOPE Layered GaAs and GaAs nanosheet stripped therefrom
Full analysis report
Reference patents
80analysable sample
Claim elements
41 locked
Design alternatives
4distinct design-around levers
Residual risk
55medium
Reference patentsLayered GaAs… → Design-around targetLayered GaAs → Design leverRemove element Conflicts with a retained element
01Reference patents

Choosing a reference patent refreshes the claim elements and design-around strategies with it.

UNIV YONSEI IACF
Layered GaAs and GaAs nanosheet stripped therefrom
2022-01 · CN-113912112-A
NANCHANG RESEARCH INST.
Wafer bonding structure and preparation method thereof
2022-01 · CN-113937084-A
GLOBALWAFERS CO LTD
Method of preparing multilayer structure
02Claim element to design around

Choose the element to work around and the strategies below are recalculated against it. Elements the design must retain are marked "retain".

01Layered GaAs

The functional block essential to realising Layered GaAs

✓Retain High relevance to the original
02Nanosheet release etch

How the release etch couples to adjacent elements

Retain High relevance to the original
03GAA

Ordering and placement conditions for GAA

Retain Medium relevance to the original
04nanosheet

Dimensional and operating ranges of the nanosheet

Retain Low relevance to the original
03Layered GaAs design-around strategies
Conflicts with a retained element
Remove element
Substitute technology
Separate functions
Change process conditions
COPILOT 6 locked

Summarise the design-around scenarios

COPILOT

The goal is to avoid conflict with the 'Layered GaAs' element in the reference claim. The target claim comprises 1) Layered GaAs, 2) coupling of the release etch to adjacent elements, 3) GAA ordering and placement, and 4) nanosheet dimensional and operating ranges.

There are four means of designing around. Remove element — move the function to an external module so it falls outside the combination. Substitute technology — realise the same function with a different mechanism or material. Separate functions — split the combined function into two blocks and a control interface.

Ask anything about the analysis on this screen.
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ChipInsight Lab · design-around scenarios · sample screen, evidence redacted

01 — Workspace map

The screens follow the order you already work in.

The scope you narrowed in IP becomes the starting point for research planning, and the alternatives that come out of it carry into business development. Evidence and constraints gathered earlier are inherited as they are.

IP IP intelligence 3 screens
Prior-art search 01

Paste the disclosure as it is and patents and papers are ranked by proximity, with white space marked as well.

Proximity ranking · white space
New technology monitoring 02

Filings, standards revisions, and sourcing shifts in the technology areas you follow, delivered daily on one page.

Monitoring digest
Technology · patent landscape 03

The claim space is laid out on technology and applicant axes to contrast occupied and open territory.

Landscape map
R&D Research planning 3 screens
Performance · configuration benchmark 04

Thermal margin, yield risk, and schedule side by side, with measured values distinguished from claimed ones.

Comparison table
R&D opportunity discovery 05

It builds the problem, hypothesis, approach, milestone, and risk skeleton with evidence attached, and drafts the DOE.

Planning skeleton · DOE
Design-around scenarios 06

Lock the elements to retain, and the viable routes are recalculated across four levers.

Design-around routes · FTO cautions
BUSINESS Business development 3 screens
Partnering · licensing 07

It organises complementary candidate companies, points of contact, and licensing routes, then drafts the joint development proposal.

Partner candidates · proposal draft
IP-R&D full analysis report 08

Evidence narrowed across several screens is bundled as argument, evidence, scenarios, and open items.

Decision pack
Prospect discovery 09

Companies likely to need your technology are shortlisted from filing history, supply chain, and hiring or investment signals, with priorities and contact points set out.

Target list · contact map
SHARED LAYER Project context Evidence store Copilot Review history All nine screens share the same evidence
02 — Copilot

Ask about the screen you are looking at, just as it is.

Copilot is already looking at the open screen. Because it knows which claims are locked and which lever you chose, you can ask only for what you need. The evidence behind an answer traces back to the item on screen.

"Which of these design-around strategies carries the lowest manufacturability risk?"

"If I unlock the retained element, how many alternatives do I get?"

"Show me only the Korean filing status within this reference patent's family"

"Draft the full analysis report from everything so far"

03 — Deliverables

Every run leaves an output you can decide from

There are nine deliverables. The one that goes straight to the executive team is the decision pack.

DECISION PACK · CYCLE 07
HBM thermal risk · accelerate vs partner
✓ Evidence traced
Argument

The thermal headroom on 12-Hi HBM closes within the next planning window. Accelerating in-house gains speed and stakes yield; partnering gives up margin and buys schedule.

Accelerate
RISK MED

Fastest · yield exposure

PartnerFavoured
RISK HIGH

Schedule certain · margin conceded

Wait
RISK LOW

Low commitment · initiative conceded

3 sources Vendor thermal specification ✓ Foundry process note ✓ Analyst outlook ! review
Other deliverables
02Comparison table
03Prior art / novelty
04Design-around
05Design of experiments (DOE)
06Root cause analysis
07Change monitoring
08R&D planning document
09Proposal draft
04 — Domain coverage

It starts already knowing your field.

The vocabulary, metrics, and failure modes of three domains are in the model. Skip the background and open with the hard problem.

01

Semiconductor

Process, device physics, yield, advanced packaging. From transistor scaling through to the supply chain.

CORE COVERAGE
OSAT · advanced packaging Silicon wafers Test · yield Materials Power · analogue Design · fabless Logic · advanced nodes Foundry · IDM RF · sensors EDA · IP Memory EUV · patterning Equipment
FRONTIER NOW
CoWoS / CoWoS-L High-NA EUV 2 nm (N2) HBM4 / HBM4E Backside power delivery (BSPDN) Hybrid bonding
As the field moves, the coverage moves with it
02

Display

Panel materials, backplane, and defect physics across OLED and next-generation self-emissive displays.

CORE COVERAGE
Backplane MicroLED · self-emissive Encapsulation Emissive materials Inspection · repair Panel makers Deposition · FMM Substrate · glass Colour filter · polariser Sets · demand
FRONTIER NOW
Gen 8.6 OLED OLEDoS Maskless OLED Tandem OLED Blue phosphorescence MicroLED mass transfer
As the field moves, the coverage moves with it
03

AI computing

Where AI workloads meet silicon. Memory, packaging, thermal, and power limits.

CORE COVERAGE
Accelerators HBM memory Chiplets Co-packaged optics SmartNIC · DPU Hyperscalers AI foundry Die-to-die (UCIe) Switch silicon Thermal · power Rack-scale systems Edge inference
FRONTIER NOW
NVLink / UALink Liquid cooling Glass substrates HBM4 bandwidth Silicon photonics CXL pooling
As the field moves, the coverage moves with it
Start with one problem

Begin the trial with your single highest-priority problem.

For example — Rc reduction strategies for GAA nanosheets, shadow-mask defect reduction in OLED, HBM thermal risk mapping. The evidence and decision from the first review become the starting point of the next planning cycle.

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